首页> 外国专利> Partly cured polyimide prepolymer - by heating aromatic polycarboxylic acid and aromatic amino cpd in dipolar aprotic solvent

Partly cured polyimide prepolymer - by heating aromatic polycarboxylic acid and aromatic amino cpd in dipolar aprotic solvent

机译:部分固化的聚酰亚胺预聚物-通过在偶极非质子传递溶剂中加热芳族多元羧酸和芳族氨基cpd

摘要

Partly cured polyimide prepolymer is prepd. by heating either (a) a mixt. of an aromatic acid monomer and an aromatic amino cpd., or (b) an aromatic aminocarboxyl cpd. at a temp. of =200 degrees C in the presence of a dipolar aprotic solvent with a b.p. of =200 degrees C and a m.p. of =0 degree C until the weight loss of the pdt. is 2 - 15%. The aromatic acid monomer consists of (1) an aromatic tetracarboxylic acid, or its dianhydride or di- or tetraesters, in which the carboxyl gps. are grouped in pairs, and each pair of carboxylic acids is bonded to adjacent C atoms or situated in the peri position relative to each other, or (2) an aromatic tricarboxylic acid, or its anhydirde, or mono-, di- or triesters, in which 2 of the carboxyl gps. are in ortho or peri relation.
机译:准备部分固化的聚酰亚胺预聚物。通过加热(a)混合料。芳族酸单体和芳族氨基cpd。或(b)芳族氨基羧基cpd。临时在具有b.p.的偶极非质子溶剂存在下> = 200°C ≥200摄氏度和m.p. ≥0摄氏度,直到pdt重量减轻。是2-15%。芳族酸单体由(1)芳族四羧酸或其二酐或二或四酯组成,其中羧基gps。羧酸是成对成对的,并且每对羧酸键合到相邻的C原子上或相对于彼此位于周边位置,或(2)芳族三羧酸或其酸酐或一,二或三酯,其中有2个羧基gps。处于直系或周边关系。

著录项

  • 公开/公告号FR2132169A1

    专利类型

  • 公开/公告日1972-11-17

    原文格式PDF

  • 申请/专利权人 IMPERIAL CHEMICAL;

    申请/专利号FR19720010991

  • 发明设计人

    申请日1972-03-29

  • 分类号C08G20/00;C08G53/00;

  • 国家 FR

  • 入库时间 2022-08-23 06:45:09

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