Semiconductor wafers - cut perpendicular to the 115 directions

摘要

Method of preparing circular semiconducting wafers and wafers so produced wherein a rod of Si or Ge is grown into a single crystal rod by zone melting with the crystal axis in a 115 direction. The directions are sufficiently near to perpendicular to the corresponding left brace 100 right brace planes that resistivity of a wafer cut perpendicular to the bar is more or less uniform in the radial direction i.e. the wafers are cut almost in the left brace 100 right brace planes. The 15 directions are 74.7 degrees from the left brace 100 right brace planes.