Metallisation of cured epoxy resin surfaces - using resin-curing agent compsn giving good adhesion without hydrophilic pretreatment

摘要

The resin components (1) comprises (A) 25-95 wt. % (a) adducts of 2 moles bisphenol A diglycidyl ether with 1 mole linoleic acid dimer (I) of formula: the adduct having epoxy equiv. 650-700, and/or (b) dglycidyl ether of (I) having epoxy equiv. 400-420, (B) 0-50 wt. % reaction proD. of 40 wt. % random acrylonitrile-butadiene copolymer (II) of formula with 60 wt. % diglycidyl ether of bisphenol A (epoxy equiv. 180-195) or of bisphenol F (epoxy equiv. 152-167) and (C) remainder diglycidyl ether of bisphenol A and/or of bisphenol F. The curing agent (2) comprises (i) 16-60 wt. % based on (1) of a suitable acid anhydride (III) and opt. is not 30 wt. % of an acid (IV) selected from HO2C-(CH2)7-CO2H, (I), (II), acid (II)' as (II) but contg. a CH(CO2H)CH2 linkage between the CH2CH(CH) and -CMe(CN)-gps. and/or/trimer acid with compsn. C54H96O6 (if (b) forms 5 wt. % of (1), then (2) contains (II) and/or (II)'), (ii) a polyamine in amt. equimolar to (1), (iii) 5 wt. % of (1) of an equimolar mixt. of polyamine and anhydride, or (iv) mixts. of (i), (ii) and/or (iii). Process is esp. for electroless deposition to give printed circuit boards.