process for umhuellen of electronic components with epoxy resin - pressmassen.

摘要

The cure time is halved and the mechanical strength considerably increased by modifying a Bisphenol A type epoxide resin with a thermosetting hydrocarbon polymer such as a polybutadiene or a polybutadiene/styrene copolymer e.g. "Plastikator 32" of "Buton 100". Recommended proportions of epoxide to the other polymer are 9:1, with filler content of 60%. Electrical breakdown strength and creep resistance are good, so that the materials are suitable for encapsulating small transformers, motors, conductors etc.