Resin-impregnated chipboard mfr - with moisture content in chipboard cake conrolled during transfer between press stages

摘要

Appts. used in the mfr. of chipboards from synthetic resin-impregnated chips, in which the chipboards are transferred between respective pressing stages without supports, includes a forming and a pre-pressing station in which the chips are supported on a substrate and between the two stations there is provided an h.f. generator which is used such that the temp. of the chipboard cake at the inlet to the pre-pressing station is approx. 10-30 degrees C higher than at the forming station.