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CALCIUM OXIDE-ALUMINUM OXIDE-SILICON DIOXIDE CERAMIC SUBSTRATE MATERIAL FOR THIN FILM CIRCUITS
CALCIUM OXIDE-ALUMINUM OXIDE-SILICON DIOXIDE CERAMIC SUBSTRATE MATERIAL FOR THIN FILM CIRCUITS
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机译:薄膜电路用氧化钙铝氧化物二氧化硅陶瓷基体材料
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1303877 Ceramics WESTERN ELECTRIC CO Inc 10 April 1970 [14-April 1969] 17149/70 Heading C1J A body comprises a ceramic surface portion having the composition by weight 30À5-40À5 CaO, 59À5-69À5 Al 2 O 3 and 10-20 SiO 2 . The ceramic surface portion is made by mixing oxides or compounds decomposable thereto, calcining the mixture, forming the calcined mixture to shape and firing. The starting mixture is milled as an aqueous or organic slurry in a ball mill, dried granulated and calcined, e.g. at 800-1100‹ C. The calcined material is pulverized, mixed with binding, lubricating or plasticizing additives and an aqueous or organic carrier and ball milled, the ball milled slurry is shaped by dry pressing, extruding or doctor blading on to a carrier substrate (which can subsequently be removed) and then fired, e.g. at 1300-1420‹ C. Electric circuit components are made by sputtering a layer of tantalum on to the surface.
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机译:1303877陶瓷WESTERN ELECTRIC CO Inc 1970年4月10日[1969年4月14日] 17149/70标题C1J主体包括一个陶瓷表面部分,该陶瓷表面部分的重量比为30‑5-40‑5 CaO,59‑5-69‑5 Al 2 O 3和10-20 SiO 2 。陶瓷表面部分是通过混合氧化物或可分解的化合物,将混合物煅烧,形成经煅烧的混合物成形和烧制而制成的。将起始混合物在球磨机中研磨成含水或有机浆液,干燥,制粒并煅烧,例如将其干燥。在800-1100℃下将煅烧的材料粉碎,与粘合,润滑或增塑添加剂和水性或有机载体混合,然后球磨,将球磨过的浆料通过干压,挤压或刮刀成型在载体基材上成型(可以随后将其删除),然后解雇,例如电路组件是通过在表面上溅射一层钽制成的。
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