A low-cost method employing precision stamping for fabricating the wafers of a multiwafer electrical circuit structure comprised of a plurality of electrically conductive wafers stacked together under pressure. A stack is normally comprised of conductive wafers of different types including component wafers, interconnection wafers, and connector wafers which are fabricated to provide X, Y and Z-axis coaxial connections between components in the stack. In accordance with the present invention, these X, Y and Z coaxial connections are fabricated directly from the wafer material itself at relatively low cost as compared to known methods as a result of the employment of a novel combination of precision stamping, dielectric filling and sanding or etching steps.
展开▼
