Coupling field for the establishment of interconnections direct has four wires, and comprising a grouping a plurality of regression is floors

• 1. 包括具有至少部分被电介质层包围的多个金属芯的互连件的互连系统 [P] . 中国专利： CN105359267B . 2018.06.05
• 2. 包括具有至少部分被电介质层包围的多个金属芯的互连件的互连系统 [P] . 中国专利： CN105359267A . 2016-02-24
• 3. Coupling field for the establishment of interconnections direct has four wires, and having a grouping a plurality of regression is floors [P] . 法国专利： FR2291673A1 . 1976-06-11

  机译： 用于建立互连的耦合场直接具有四根导线，并且具有多个回归底的分组

• 4. coupling field for the establishment of direct interconnections with a four wire and has several floors off [P] . BE835599A . 1976-05-14

  机译： 耦合场，用于通过四根导线建立直接互连，并具有几层楼

• 5. coupling field for the establishment of direct interconnections has four sons and with several floors by a turning [P] . BE835598A . 1976-05-14

  机译： 用于建立直接互连的耦合场有四个儿子，并通过转弯在几个楼层上

• 1. Revealing the plasmon coupling in gold nanochains directly from the near field [J] . Quan Sun, Han Yu, Kosei Ueno, 光电进展（英文版） . 2019,第004期
• 2. Revealing the plasmon coupling in gold nanochains directly from the near field [J] . Quan Sun, Han Yu, Kosei Ueno, 光电进展（英文） . 2019,第004期
• 3. Equivalent Circuit Model for Radiating Lossy Wire-Interconnection Structures Including External Field Coupling [C] . C. Bednarz, M. Leone International Conference on Electromagnetics in Advanced Applications . 2017
• 4. Electric-Field Noise Scaling and Wire-Mediated Coupling of Remote Ions in a Novel Elevator Surface Trap [D] . An, Da. 2021
• 5. Hybrid All-Atom/Coarse-Grained Simulations of Proteins by Direct Coupling of CHARMM and PRIMO Force Fields [O] . Parimal Kar, Michael Feig -1
• 6. Analysis of Horizontal and Vertical Couplings in Bonding Wire Interconnections Using EFIE with Cylindrical Conduction Mode Basis Functions [O] . Ki Jin Han, Madhavan Swaminathan, Ege Engin 2015
• 7. Field Coupling Parameters for a Single Round Wire Close to a Ground Plane of Two Large Round Wires in Free Space [R] . Frankel, S. 1972

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