Diamond brazing method for slow wave energy propagating structures

摘要

Diamond heat sink members are now employed to conduct thermal energy from slow wave structures in traveling wave type interaction devices to permit operation at high power levels. The diamond members are bonded to adjacent desired components by a method including heating an intermediate metal alloy of an inactive conductive metal and a small amount of a carbide constituent in a vacuum and the application of pressure. A critical temperature slightly above the melting point of the alloy of between 1000° C and 1100° C is required to wet and bond the alloy material to the diamond and any desired surface.