首页> 外国专利> Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization

Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization

机译:用于中和和敏化树脂表面以及用于粘附金属化的改进的敏化树脂表面的组合物和方法

摘要

A new composition and method for treating resinous surfaces that are to be metallized, and an improved sensitized substrate resulting therefrom. A resinous surface that has been conditioned by an oxidizer is treated with an aqueous solution comprising hydrazine to neutralize the surface and provide an improved sensitized surface for subsequent metallization. A preferred form of the solution also includes a pH adjuster and a sequestering agent.
机译:用于处理将被金属化的树脂表面的新的组合物和方法,以及由此得到的改进的敏化基底。用氧化剂处理过的树脂表面用包含肼的水溶液处理,以中和该表面并提供用于后续金属化的改进的敏化表面。溶液的优选形式还包括pH调节剂和螯合剂。

著录项

  • 公开/公告号US3962496A

    专利类型

  • 公开/公告日1976-06-08

    原文格式PDF

  • 申请/专利权人 PHOTOCIRCUITS DIVISION OF KOLLMORGEN;

    申请/专利号US19740521866

  • 发明设计人 EDWARD J. LEECH;

    申请日1974-11-07

  • 分类号C23C3/02;

  • 国家 US

  • 入库时间 2022-08-23 01:32:07

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