METHOD OF FORMING JET STREAM OF PLATING SOLUTION IN HORIZONTAL TYPE ELECTROPLATING AND APPARATUS FOR SAID METHOD

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• 2. 电镀锡液中整平剂浓度的测试方法及电镀空白溶液 [P] . 中国专利： CN113913913A . 2022-01-11
• 3. METHOD OF FORMING JET STREAM OF PLATING SOLUTION IN HORIZONTAL TYPE ELECTROPLATING AND APPARATUS FOR SAID METHOD [P] . 日本专利： JPS5521836B2 . 1980-06-12

  机译： 水平式电镀中形成溶液的射流流道的方法及方法

• 4. ELECTROPLATING APPARATUS FOR CONTROLLING CONCENTRATION OF METAL IONS CONTAINED IN PLATING SOLUTION TO UNIFORMIZE CONTENT OF PLATING FILM FORMING METAL AND ELECTROPLATING METHOD USED BY THE APPARATUS [P] . 韩国专利： KR20040108038A . 2004-12-23

  机译： 用于控制镀液中所含金属离子的浓度以使镀膜成膜金属的含量均匀的电镀装置及其使用的电镀方法

• 5. Method for preparing low-melting-point plating solution for aluminum electroplating, plating solution for aluminum electroplating, method for producing aluminum foil, and method for lowering melting point of plating solution for aluminum electroplating [P] . 美国专利： US9382634B2 . 2016-07-05

  机译： 铝电镀用低熔点电镀液的制备方法，铝电镀用电镀液，铝箔的制造方法以及降低铝电镀用电镀液的熔点的方法

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