Heat-sink for semiconductor oscillator - has voltage liquid vaporising in closed chamber to transfer heat to external cooling fin

摘要

The heat sink is for a semiconductor oscillator and consists of an enclosed chamber which contains a volatile liquid (7). The semiconductor oscillator (1) is located in a hermetically sealed enclosure beneath the vessel and is in thermal contact with the thermally-conducting bottom plate of the chamber. Heat is transferred from the oscillator to the liquid, which then vaporises and condenses on the upper plate of the chamber. The upper thermally-conducting plate is connected to an external cooling fin (5) and the liquid chamber is provided with a pressure release valve (8) and is enclosed in insulating material (6).