首页> 外国专利> Prefabricated panel assembled underfloor laying - has levelling layer laid first, and hollows between panel underside ribs

Prefabricated panel assembled underfloor laying - has levelling layer laid first, and hollows between panel underside ribs

机译:预制面板组装好的地板铺设-首先铺设整平层,并在面板下侧肋之间形成空腔

摘要

The process, involves application of a sufficiently thick levelling layer onto the base, so as to produce a flat bearing surface, following a normal flooring surface casting process. When the levelling layer has been adequately consolidated the prefabricated panels are laid on it, with protrusions or cutouts on their undersides. These form hollow spaces between panels and levelling layer, and moisture collecting in this area is conducted away sideways by means of these. Trowelling may be subsequently carried out on top, to eliminate panel joint gaps. The underfloor can be walked on as soon as it is laid.
机译:该方法涉及在正常的地板表面浇铸过程之后,将足够厚的流平层施加到基底上,以产生平坦的支承表面。当找平层已充分固结后,将预制板放置在其上,并在其下侧凸出或挖出缺口。它们在面板和找平层之间形成中空空间,并且通过这些将在该区域中聚集的水分从侧面带走。随后可以在顶部进行抹平,以消除面板的缝隙。地板铺设完毕后,即可继续行走。

著录项

  • 公开/公告号DE2539134A1

    专利类型

  • 公开/公告日1977-03-17

    原文格式PDF

  • 申请/专利权人 HOELLFRITSCHERICHDIPL.-VOLKSW.;

    申请/专利号DE19752539134

  • 发明设计人 HOELLFRITSCHERICHDIPL.-VOLKSW.;

    申请日1975-09-03

  • 分类号E04F15/00;E04F15/10;

  • 国家 DE

  • 入库时间 2022-08-23 00:04:48

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