Low viscosity hot melt adhesive, esp for bonding metals - contg dimeric acid modified poly(methylene terephthalate) and vinyl aromatic polymer

摘要

The adhesive compsn. consists of (A) 50-98 wt.% copolyester of (1) is not 80 mole % butan-1,4-diol, (2) is not 48 mole % terephthalic acid or an ester-forming deriv. of this and (3) 5-40 mole % dimeric acid; and (B) 50-2 wt.% polymer with is not 50 wt.% of its polymer units derived from monomer(s) of formula (I):- (where R is H or 1-4C alkyl; R1 is H, Cl, Ph or 1-4C alkyl). It can be used for coating a substrate or for bonding 2 substrates, =1 being a metal. After ageing, the material has high adhesive strength at elevated temps.