首页> 外国专利> Self-levelling thermosetting resin contg. microfillers - with low resin content, for moulding, coating, potting etc.

Self-levelling thermosetting resin contg. microfillers - with low resin content, for moulding, coating, potting etc.

机译:自流平热固性树脂(续)。微填料-树脂含量低,用于模塑,涂覆,灌封等

摘要

Synthetic resin compns. for moulding, coating, for use as mastics and as potting compns. e.g. for electrical equipment, comprise: 20-80 (vol.)% of a thermosetting resin and a hardener, 80-20% inorg. filler and 1-30% of a microfiller (I) of particle size 5 mu and at least partly of spheroidal shape, the % being based on total vol. The compsn. is prepd. by (a) dispersing the (I) in the resin before adding the other components (b) dispersing (I) in the hardener before prepn. of the total mixt., (c) dispersing (I) in the resin and the hardener or (d) mixing (I) with a mixt. of the resin, the hardener and the filler. The use of (I) enables a low resin content to be used even if the compsn. is to be self-levelling, the compsn. being further easy to work and apply by trowel.
机译:合成树脂组合物。用于模制,涂层,用作乳香和灌封料。例如用于电气设备的材料包括:20-80(vol。)%的热固性树脂和硬化剂,80-20%的无机盐。填充剂和1-30%的微填充剂(I),其粒径为5微米,至少部分为球形,其百分比基于总体积。该compsn。准备好了。通过(a)在添加其他组分之前将(I)分散在树脂中(b)在制备之前将(I)分散在硬化剂中。 (c)将(I)分散在树脂和固化剂中,或(d)将(I)与混合物混合。树脂,硬化剂和填料。通过使用(I),即使配合量也可以使用低树脂含量。要自我调平,compsn。可以更轻松地工作并通过抹子进行施工。

著录项

  • 公开/公告号FR2281394B3

    专利类型

  • 公开/公告日1977-06-17

    原文格式PDF

  • 申请/专利权人 SCHERING AG;

    申请/专利号FR19740030273

  • 发明设计人

    申请日1974-09-06

  • 分类号C08K7/16;C08J5/00;C09D3/48;

  • 国家 FR

  • 入库时间 2022-08-22 23:51:28

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