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Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation
Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation
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机译:通过替换包含金属铜和银的薄膜,而不会随后加速氧化
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摘要
Novel copper-silver metallic films are prepared on transparent articles by chemical replacement of silver for copper according to the method of the present invention. A transparent article is coated with a metallic copper film by a conventional method of deposition. The copper coated article is then contacted by a solution comprising a silver salt, ammonia and a complexing agent which promotes replacement but which does not accelerate the oxidation of residual metallic copper in the film. Replacement of copper by silver occurs with the film retaining its reflective metallic character.
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