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Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation

机译:通过替换包含金属铜和银的薄膜,而不会随后加速氧化

摘要

Novel copper-silver metallic films are prepared on transparent articles by chemical replacement of silver for copper according to the method of the present invention. A transparent article is coated with a metallic copper film by a conventional method of deposition. The copper coated article is then contacted by a solution comprising a silver salt, ammonia and a complexing agent which promotes replacement but which does not accelerate the oxidation of residual metallic copper in the film. Replacement of copper by silver occurs with the film retaining its reflective metallic character.
机译:根据本发明的方法,通过化学取代银代替铜,在透明制品上制备新颖的铜-银金属膜。通过常规的沉积方法用金属铜膜涂覆透明制品。然后使铜涂覆的制品与包含银盐,氨和络合剂的溶液接触,该溶液促进置换,但不加速膜中残留金属铜的氧化。用银代替铜可以使膜保持其反射金属特性。

著录项

  • 公开/公告号US3993845A

    专利类型

  • 公开/公告日1976-11-23

    原文格式PDF

  • 申请/专利权人 PPG INDUSTRIES INC.;

    申请/专利号US19750569334

  • 发明设计人 CHARLES B. GREENBERG;PETER P. HARMON;

    申请日1975-04-17

  • 分类号B32B15/04;B32B15/08;B05D1/36;

  • 国家 US

  • 入库时间 2022-08-22 23:37:56

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