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the process of formation of n-type by ion implantation of arsenic and silicon germanium on a substrate

机译:砷和硅锗离子注入到衬底上形成n型的过程

摘要

A method for forming N conductivity-type regions in a silicon substrate comprising ion implanting arsenic to form a region in said substrate having an arsenic atom concentration of at least 1 x 10-2 As atoms/total atoms in substrate, and ion implanting germanium into said substrate region. Even though the atomic radius of arsenic is very close to that of silicon -- the arsenic radius is only 0.5% smaller -- when high arsenic atom concentrations of at least 1 x 10-2 atoms/total atoms in the substrate are introduced in the substrate, and such high concentrations are only possible when arsenic is ion implanted, then atomic misfit dislocations will occur. The implanted germanium atoms compensate for the lattice strain in the silicon to minimize dislocations.
机译:一种在硅衬底中形成N个导电类型区域的方法,该方法包括离子注入砷以在所述衬底中形成砷原子浓度至少为衬底中砷原子/总原子至少1×10-2 As的区域,以及离子注入锗到衬底中。所述衬底区域。即使砷的原子半径与硅的原子半径非常接近-砷半径也仅减小0.5%-当在基板中引入至少1 x 10-2原子/总原子的高砷原子浓度时,这样的高浓度只有在离子注入砷后才有可能,然后会发生原子错配位错。注入的锗原子补偿了硅中的晶格应变,从而使位错最小化。

著录项

  • 公开/公告号BE860359A

    专利类型

  • 公开/公告日1978-02-15

    原文格式PDF

  • 申请/专利权人 INTERNATIONAL BUSINESS MACHINES CORP.;

    申请/专利号BE19770182249

  • 发明设计人

    申请日1977-10-31

  • 分类号B01J;

  • 国家 BE

  • 入库时间 2022-08-22 22:58:34

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