首页> 外国专利> Discrete crossover chips for individual conductor track crossovers in hybrid circuits and method for constructing same

Discrete crossover chips for individual conductor track crossovers in hybrid circuits and method for constructing same

机译:用于混合电路中各个导体轨迹交叉的离散交叉芯片及其构造方法

摘要

A form of construction of and a method for fabricating individual conductor paths in hybrid circuits having conductor crossovers are described. Integrated circuit chips forming the crossovers are metallized so that at least the peripheral areas crosswise to the crossed conductor paths are free from metal.
机译:描述了具有导体跨接的混合电路中的单个导体路径的构造形式和制造方法。形成交叉点的集成电路芯片被金属化,使得至少与交叉的导体路径交叉的外围区域没有金属。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号