Solderable wiring prodn. on printed circuit board - anodising and copper plating hardened organic binder coating contg. metal powder, gives firm adhesion

摘要

Prodn. of printed circuit boards with solderable conductive tracks or areas on an insulating substrate involves first applying a mixt. of very small particles of conductive noble and/or base metals and/or their alloys in an organic binder in the required pattern and hardening the binder. The coated substrate is then made first the anode and then the cathode in a Cu electroplating bath, so that a Cu film is formed, which is in electrical contact with the metal particles through pores and flaws in the hardened compsn. The process is simple and gives firmly adhering tracks.