Dental prosthesis composite solder - bonds dental porcelain to non-precious metal substrate

摘要

A composite solder and process for soldering a dental porcelain to a non-precious metal alloy substrate in a dental prosthesis are described. The composite solder consists of (a) either B or a mixt. of B and Al and (B) a C-contng. material which will produce a reducing atmos. at is approx. 649-1066 degrees C. The process comprises applying a uniform layer of the composite solder to a cleaned metal substrate, heating the substrate from is approx. 649 degrees C. to 982-1038 degrees C., cleaning the coated surfaces and applying and firing the dental porcelain. The bond strength is greater than that between porcelain and a substrate which has been mechanically bonded i.e. dependent on surface roughness.