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The bath of metallization with nickel - palladium in the electrolytic deposition and advantages of using such a bath metallization

机译:在电解沉积中用镍钯进行金属化的镀液及使用这种镀液的优点

摘要

P bath of metallization with nickel - palladium and method for applying a nickel alloy - palladium on elements such as connectors, the pins or the like. / p & & p & the bath is constituted by the palladosammine chloride, nickel sulfamate, the ammonium sulphamate and ammonium hydroxide. The components 10 to be plated are held in a frame 18 and immersed in the bath. The deposition of the palladium - nickel alloy takes place at ambient temperature and with a current density of between 0,3 x 10 * * - 2 and 3 × 10 * * - 2 amperes / cm 2 * *.... / p & & p & this process is used to coat a metal deposit of the electrical components, in particular of the connection devices. / p
机译:

用镍-钯进行金属化的镀液,以及将镍合金-钯施加到诸如连接器,销等元件上的方法。 & &该浴由氯化帕拉米胺,氨基磺酸镍,氨基磺酸铵和氢氧化铵组成。待电镀的部件10被保持在框架18中并浸入浴中。钯-镍合金的沉积是在环境温度下进行的,电流密度在0.3 x 10 * *-2和3×10 * *-2安培/ cm 2 * * ....之间。 & & &该过程用于涂覆电气部件,特别是连接装置的金属沉积物。

著录项

  • 公开/公告号FR2370802B1

    专利类型

  • 公开/公告日1979-03-02

    原文格式PDF

  • 申请/专利权人 IBM;

    申请/专利号FR19770029875

  • 发明设计人

    申请日1977-09-28

  • 分类号C25D3/56;H01R43/00;

  • 国家 FR

  • 入库时间 2022-08-22 19:36:08

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