首页> 外国专利> Electroless nickel plating of metals, plastics, or ceramics - using periodically replenished bath kept an constant density

Electroless nickel plating of metals, plastics, or ceramics - using periodically replenished bath kept an constant density

机译:金属,塑料或陶瓷的化学镀镍-使用定期补充镀液以保持恒定的密度

摘要

The bath contains nickel salt, sodium citrate, NH4Cl, NH4OH, sodium hypophosphite, a water-soluble polyhydroxy benzene, and a copper salt, with an initial density of 1.075-1.116 g/cm3, esp. 1.099 g/cm3 which remains at this value during plating. The initial density is pref. achieved by adding Na2SO4 as a dummy salt, and during plating, part of the bath is automatically and periodically removed at short time intervals and replaced by a replenishing soln. (R) and water to keep the density at 1.099. For Ni coating of a metal substrate, the latter is pref. first exposed as a cathode to a voltage of 8-12V for 2-10 seconds. Used e.g. for small or large relay poles made of metal sheet, or for substrates with a complex shape.
机译:该浴包含镍盐,柠檬酸钠,NH4Cl,NH4OH,次磷酸钠,水溶性多羟基苯和铜盐,初始密度为1.075-1.116 g / cm3,特别是。 1.099 g / cm3,在电镀过程中保持此值。初始密度为首选。通过添加作为假盐的Na2SO4可以实现,并且在电镀过程中,部分电镀液会在短时间间隔内自动周期性地去除,并由补充液代替。 (R)和水保持密度在1.099。对于金属基底的Ni涂层,后者是优选的。首先作为阴极暴露在8-12V的电压下2-10秒。用过的适用于由金属板制成的小型或大型继电器极,或用于形状复杂的基板。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号