首页> 外国专利> A method for traeger strips of the connecting pins arranged on circuit boards and tauchloetbad for carrying out the method

A method for traeger strips of the connecting pins arranged on circuit boards and tauchloetbad for carrying out the method

机译:一种用于布置在电路板上和tauchloetbad上的连接销的跨接条的方法,用于执行该方法

摘要

A method of soldering connection pins on carrier strips to printed circuit boards, notably to thick-film modules. Prior to soldering in a soldering bath, a printed circuit board is detachably connected to the connection pins. An endless carrier strip with the connection pins and printed circuit boards in the upright position is horizontally fed through liquid solder which flows off the components to be soldered at the surface. Solder which does not wet or connect the components flows away at the end of the predetermined soldering path, preferably in the transport direction of the parts, to a level below that of the carrier strip.
机译:一种将载体条上的连接销焊接到印刷电路板上的方法,尤其是厚膜模块。在焊接槽中进行焊接之前,将印刷电路板可拆卸地连接到连接销。将具有竖直连接位置的连接销和印刷电路板的环形载体条水平地馈送通过液态焊料,该液态焊料从要在表面上焊接的组件流出。不润湿或连接部件的焊料在预定的焊接路径的末端,优选地在部件的输送方向上,流到低于承载带的水平。

著录项

  • 公开/公告号DE3006431B1

    专利类型

  • 公开/公告日1980-10-16

    原文格式PDF

  • 申请/专利权人 PHILIPS PATENTVERWALTUNG;

    申请/专利号DE19803006431

  • 发明设计人 BODEWIG MANFRED;

    申请日1980-02-21

  • 分类号B23K1/08;H05K3/34;

  • 国家 DE

  • 入库时间 2022-08-22 17:29:04

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