首页> 外国专利> Hardenable, liq. graft copolymer contg. epoxide gps. - prepd. from epoxide, unsaturated acid and/or anhydride, alkyl acrylate and hydroxyalkyl (meth)acrylate

Hardenable, liq. graft copolymer contg. epoxide gps. - prepd. from epoxide, unsaturated acid and/or anhydride, alkyl acrylate and hydroxyalkyl (meth)acrylate

机译:可硬化,轻度接枝共聚物续环氧GPS。 -准备由环氧化物,不饱和酸和/或酸酐,丙烯酸烷基酯和(甲基)丙烯酸羟烷基酯

摘要

Hardenable, liq., epoxide gp.-contg. graft copolymers (C) are prepd. by a free radical-initiated graft copolymerisation process in organic soln. The reaction batch contains (by wt.) (A) 30-80% liq. epoxide cpds. contg. 1 epoxide gp. per molecule, of viscosity 15-14000 cP at 25 degrees C and epoxide equiv. wt. 120-450, dissolved in inert solvents of b. pt. 40-150 degrees C, and (B) 70-20% mixt. consisting (by wt.), of (a) 2-10% 3-5c ethylenically unsatd. acid and/or its anhydride, (b) 70-93% acrylic acid ester of aliphatic saturated 1-18C monohydric alcohols and (c) 5-25% monohydroxy 2-8 C-alkyl ester of 3-5C alpha, beta-ethylenically unsatd. acids. Reaction batch is kept at 60-150 degrees C until graft copolymerisation is completed. Solvent is opt. distilled off under reduced press. at below 130 degrees C. (C) are used for preparing hardenable, solvent-free or low-solvent coating- and/or moulding compsns.; as casting resins in electrical industry, esp. for embedding temp.-sensitive switch units; as sealing compsns. and in the prepn. of adhesives. (C) can be stored for several months at 40 degrees C and are miscible with epoxide hardeners. Mixts. of (C) and hardeners can be used as solvent-free binders, yielding solvent- and weather-resistant coatings at room temp. Hardened prods. have high impact strength, temp. change stability, weatherability and plasticity also at low temps. In an example, graft copolymer is prepd. from a pentaerythritol/epichlorohydrin epoxide, bu acrylate, hydroxyethyl methacrylate and acrylic acid.
机译:硬化,液化,环氧胶(续)。制备接枝共聚物(C)。通过自由基引发的有机溶剂接枝共聚过程。反应批料包含(重量)(A)30-80%液体。环氧化物续gp> 1。每分子,在25摄氏度和环氧当量下的粘度为15-14000 cP。重量120-450,溶于b的惰性溶剂中。点40-150摄氏度,和(B)70-20%混合。 (按重量计)由(a)2-10%3-5c的烯键式不饱和键组成。酸和/或其酸酐,(b)脂族饱和1-18C一元醇的70-93%丙烯酸酯和(c)3-5Cα-β-烯键式的5-25%单羟基2-8 C-烷基酯不满意酸。将反应批料保持在60-150℃,直到接枝共聚完成。选择溶剂。在减压下蒸馏出。在低于130℃的温度下(C)用于制备可硬化的,无溶剂或低溶剂的涂料和/或模塑组合物。作为电气工业中的铸造树脂,尤其是用于嵌入对温度敏感的开关单元;作为密封组件。并在准备中。粘合剂。 (C)可以在40摄氏度下保存几个月,并且可以与环氧固化剂混溶。混音。 (C)的固化剂和固化剂可用作无溶剂的粘合剂,可在室温下产生耐溶剂和耐候性涂料。硬化的产品。具有很高的冲击强度,温度在低温下也会改变稳定性,耐候性和可塑性。在一个实例中,制备接枝共聚物。由季戊四醇/环氧氯丙烷环氧化合物,丙烯酸丁酯,甲基丙烯酸羟乙酯和丙烯酸组成。

著录项

  • 公开/公告号FR2343008B3

    专利类型

  • 公开/公告日1980-02-08

    原文格式PDF

  • 申请/专利权人 HOECHST AG;

    申请/专利号FR19770006176

  • 发明设计人

    申请日1977-03-03

  • 分类号C08F283/10;C08G59/20;C09D3/58;

  • 国家 FR

  • 入库时间 2022-08-22 17:25:12

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