spritzvorrichtung for injection of several components existing in a mauerwerksbohrung aushaertbaren binder

• 1. 将填充材料注入复合层中的孔中的装置和方法 [P] . 中国专利： CN109676110A . 2019-04-26
• 2. 用于水平井中的聚合物注入的交替螺旋流控制装置 [P] . 中国专利： CN109415934B . 2021.02.19
• 3. spritzvorrichtung for injection of several components existing in a mauerwerksbohrung aushaertbaren binder [P] . ATA597678A . 1980-06-15

  机译： 用于注入存在于砌体孔中的可硬化粘合剂中的几种组分的注入装置

• 4. spritzvorrichtung for injection of a binder in a mauerwerksbohrung [P] . 德国专利： DE000007909499U1 . 1982-05-27

  机译： 用于将粘合剂注入砌体孔中的注入装置

• 5. spritzvorrichtung for injection of a binder in a mauerwerksbohrung [P] . 法国专利： FR2453252A1 . 1980-10-31

  机译： 用于将粘合剂注入砌体孔中的注入装置

• 1. A novel binder and binder extraction method for powder injection molding of tungsten cemented carbide [J] . 祝宝军, 曲选辉, 陶颖 中国有色金属学报（英文版） . 2003,第002期
• 2. Chemistry principles for thermoplastic polymer binder formula selection for powder injection molding [J] . 梁叔全, 唐艳, 黄伯云, 中国有色金属学报（英文版） . 2004,第004期
• 3. Development of wax-oil-polyethylene binder for Fe-2Ni powder injection molding [J] . 中国有色金属学报（英文版） . 2000,第004期
• 4. DEVELOPMENT OF SILICON NITRIDE BEARING COMPONENTS BY POWDER INJECTION MOLDING USING A NOVEL BINDER SYSTEM [C] . Zhang Weiru, Zheng Yu, Wang Tengfei International Symposium on Ceramic Materials and Components for Energy and Environmental Applications . 2016
• 5. Characterization of polymeric binders for Metal Injection Molding (MIM) process. [D] . Adames, Juan M. 2007
• 6. Evaluation of Glycaemic Control Glucose Variability and Hypoglycaemia on Long-Term Continuous Subcutaneous Infusion vs. Multiple Daily Injections: Observational Study in Pregnancies With Pre-Existing Type 1 Diabetes [O] . Aleksandra Jotic, Tanja Milicic, Katarina Lalic, 2020
• 7. The development of powder injection moulding binders: A quantification of individual components' interactions [O] . Bleyan Davit, Hausnerová Berenika, Svoboda Petr 2015

• 1. Influence of binder composition on the rheological behavior of injection-molded microsized SiC suspensions [J] . Shubin Ren ,Xinbo He ,Xuanhui Qu . 矿物冶金与材料学报 . 2008,第003期
• 2. Solvent de binding of water soluble binder in powder injection moulding [J] . Li Songlin(李松林) ,Huang Baiyun(黄伯云) ,Qu Xuanhui(曲选辉) . 中国有色金属学会会刊：英文版 . 1999,第3期
• 3. 硅中H<'+>、He<'+>注入引起的纳米孔层及其应用 [C] . 林成鲁 . 第九届全国电子束.离子束.光子束学术年会 . 1997
• 4. 离子注入在发酵工业中的应用及研究N离子注入热带假丝酵母菌对其十三碳二元酸产量的影响 [A] . 杨艳斐 . 2001