Improved structure of Electronic Packaging, pro - view of a substrate in Plateau areas

摘要

System for Electronic Packaging with high Scale integration. Carrier metal Plates (10, 11), together with an Insulating Dielectric layers, combine to form a sandwich Carrier (33). On this are the pin LSI (30) with Terminals (c-4), which comes from the power of the carrier sheet metal (10, 11).A Network of wires (14) provides a structure of Thin Film Interconnection System, on one hand, the sandwich Carrier (33). The connection between two different protadores (32, 33) via Plugs (15). The Electric current is supplied through current bars (16). A decoupling capacitor (31) is associated with the tablet LSI (30).The system can inhibit the electrical Noise generated by simultaneous switching of a large number of LSI Circuits; minimizes the inductance of the Encapsulated structure. Application to high-speed Computers.