Stable gold electroplating soln. - contg. potassium EDTA gold sulphate complex, alkali metal EDTA salt, potassium sulphate and potassium hydrogen phosphate

摘要

The electrolyte contains 10.5-123.0 (pref. 10.5-25.0) g/l hexapotassium mu-ethylene diaminotetraacetate bis(aurons sulphite), 17.8-140.0 (pref. 17.8-40.0) g/l alkali metal salt (pref. disodium-dipotassium salt) of EDTA, 12.6-110.0 (pref. 12.6-28.4) g/l potassium sulphate, 4.7-40.0 (pref. 4.7-10.4) g/l potassium hydrogen phosphate, balance water. The electrolyte is useful for plating copper, brass, bronze and stainless steel (without nickel pre-plating) substrates in the mfr. of electronic, watch, jewellery and radio-engineering components.