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Method for determining silicon content in layers of aluminum and silicon
Method for determining silicon content in layers of aluminum and silicon
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机译:测定铝和硅层中硅含量的方法
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摘要
The method provides an extremely fast and non-destructive method for determining whether an integrated circuit will have good bonding characteristics. The method entails immersion plating of copper onto aluminum areas. Then, the aluminum areas are observed visually to see if the copper plated thereon is continuous or discontinuous. If the copper is discontinuous, the aluminum film will have good bonding characteristics.
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