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SUPPLYING METHOD FOR PALLADIUM TO PALLADIUM-NICKEL ALLOY PLATING SOLUTION

机译:钯至钯镍合金镀液的供应方法

摘要

PURPOSE:To supply Pd to an aqueous ammonia soln. contg. a prescribed amount each of Pd and Ni as a plating soln. without interruption of the plating by directly addting crystalline Pd(NH3)4Cl2 to the soln. and carrying out the electroplating of a Pd-Ni alloy. CONSTITUTION:Crystalline Pd(NH3)4Cl2 or Pd(NH3)4Cl2.H2 Ois added to a relating soln, plating soln. consist of an aqueous ammonia soln. contg. 5-30g/l Ni and the electroplating of a Pd-Ni alloy is carried out. The crystalline Pd salt is easily soluble in the plating soln. itself as well as in water and an aqueous ammonia soln. Accordingly, it is directly added even to a plating soln. with low ammonia concn., whereby the soln. can be reproduced without interrupting plating and increasing the amount of the soln. For example, where 5g Pd(NH3)4Cl2.H2O (2g as Pd) is charged into 1l plating soln. and agitated, it is throughly dissolved in 0.5-1min.
机译:目的:向氨水溶液中供应钯。续规定量的钯和镍作为电镀液。通过将结晶的Pd(NH3)4Cl2直接添加到溶液中而不会中断电镀。进行Pd-Ni合金的电镀。组成:晶体Pd(NH3)4Cl2或Pd(NH3)4Cl2.H2O被添加到相关的镀液中。由氨水溶液组成。续进行5〜30g / l的Ni电镀和Pd-Ni合金的电镀。结晶的Pd盐易溶于电镀液中。本身以及在水中和氨水溶液中。因此,甚至将其直接添加到电镀液中。用低浓度的氨水,从而溶解。可以在不中断电镀和增加锡量的情况下进行再生。例如,将5克Pd(NH3)4Cl2.H2O(2克为Pd)装入1升电镀液中。搅拌,在0.5-1min内完全溶解。

著录项

  • 公开/公告号JPS5760090A

    专利类型

  • 公开/公告日1982-04-10

    原文格式PDF

  • 申请/专利权人 NITSUSHIN KASEI KK;SUWA SEIKOSHA KK;

    申请/专利号JP19800135623

  • 发明设计人 KOSHIRO HIROTOMO;KANAI MASAO;

    申请日1980-09-29

  • 分类号C25D3/56;C25D21/18;

  • 国家 JP

  • 入库时间 2022-08-22 13:58:52

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