首页> 外国专利> Forming wiring pattern on acrylic! glass plate - by printing waterproof adhesive on copper foil bonded to carrier with soluble adhesive, etching and transfer

Forming wiring pattern on acrylic! glass plate - by printing waterproof adhesive on copper foil bonded to carrier with soluble adhesive, etching and transfer

机译:在亚克力上形成接线图!玻璃板-通过在铜箔上印刷防水粘合剂,并用可溶性粘合剂将其粘合到载体上,蚀刻和转移

摘要

In the application of electric wiring patterns to acrylic glass plates, esp. floodlight plates, a Cu foil is bonded to a stainless steel or plastics carrier plate with a water-soluble adhesive. An activatable, etching-resistant and waterproof synthetic rubber-based adhesive is screen printed on this Cu foil in the required pattern and, after the adhesive has dried, the unprinted Cu foil is etched away from the carrier plate. The wiring pattern is then transferred to the acrylic glass plate by activating the second adhesive with a solvent or by direct or capacitive heating and the whole is placed in water to dissolve the water-soluble adhesive, until the substrate plate can be lifted off. Di-ficulties of obtaining the required adhesion encountered in relatively costly electroplating processes are avoided.
机译:特别是在将电气布线图案应用于丙烯酸玻璃板上时。在泛光灯板上,铜箔通过水溶性粘合剂粘合到不锈钢或塑料承载板上。将可活化的,耐腐蚀且防水的合成橡胶基胶粘剂按要求的图案丝网印刷在该铜箔上,并且在胶粘剂干燥之后,将未印刷的铜箔从载体板上蚀刻掉。然后,通过用溶剂活化第二种粘合剂或通过直接或电容加热将布线图案转移到丙烯酸玻璃板上,然后将整个模型置于水中以溶解水溶性粘合剂,直到可以提起基板为止。避免了在相对昂贵的电镀过程中获得所需粘合力的困难。

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