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Improvements bringest to the photovoltaic devices and to the current rectifier devices

机译:改进带来了光伏设备和目前的整流器设备

摘要

A SCHOTTKY BARRIER SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME A first layer of semiconductor device is of doped amorphous silicon prepared by a glow discharge in a mixture of silane and a doping gas. The first layer is on a substrate having good electrical properties. On the first layer and spaced from the substrate is a second layer of amorphous silicon prepared by a glow discharge in silane. On the second layer opposite the first layer is a metallic film forming a surface barrier junction therebetween, i.e. a Schottky barrier. The first layer is doped so as to make an ohmic contact with the substrate. Preferably the doping concentration of the first layer is graded so the dopant concentration is maximum at the interface of the first layer and the substrate. In a second embodiment of the Schottky barrier semiconductor device an intermediate layer is between and contiguous to both the first layer and the substrate. The intermediate layer facilitates in making ohmic contact between the amorphous silicon and the substrate. Annealing and heat treating steps are performed in the fabrication of the Schottky barrier device to increase device efficiency.
机译:肖特基势垒半导体器件及其制造方法半导体器件的第一层是通过在硅烷和掺杂气体的混合物中通过辉光放电制备的掺杂非晶硅。第一层在具有良好电性能的衬底上。在第一层上并与基板间隔开的是第二层非晶硅,该第二层是通过硅烷中的辉光放电制备的。在与第一层相对的第二层上是在其间形成表面势垒结的金属膜,即肖特基势垒。掺杂第一层以便与衬底形成欧姆接触。优选地,对第一层的掺杂浓度进行分级,使得在第一层和衬底的界面处的掺杂剂浓度最大。在肖特基势垒半导体器件的第二实施例中,中间层在第一层和衬底之间并且与第一层和衬底都邻接。中间层有助于在非晶硅和衬底之间进行欧姆接触。在肖特基势垒器件的制造中执行退火和热处理步骤以提高器件效率。

著录项

  • 公开/公告号FR2345810B1

    专利类型

  • 公开/公告日1982-04-09

    原文格式PDF

  • 申请/专利权人 RCA CORP;

    申请/专利号FR19770008346

  • 发明设计人

    申请日1977-03-21

  • 分类号H01L21/203;H01L29/48;H01L31/04;

  • 国家 FR

  • 入库时间 2022-08-22 12:32:34

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