process and device for the implementation of the rectification process, and the processing of parts formed from materials to brittle fracture.

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  机译： 的过程和装置，用于实施整改过程，以及由材料脆性断裂形成的零件的加工

• 4. processing pieces consisting of materials to brittle fracture. [P] . IT8423436D0 . 1984-11-02

  机译： 加工由易碎材料组成的碎片。

• 5. LASER PROCESSING METHOD FOR BRITTLE MATERIAL SUBSTRATE AND LASER PROCESSING DEVICE FOR BRITTLE MATERIAL SUBSTRATE [P] . 韩国专利： KR20130086166A . 2013-07-31

  机译： 脆性材料基质的激光加工方法及脆性材料基质的激光加工装置

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