since autocatalytic copper alloys, of a metal selected from nickel, cobalt and their mixtures, and phosphorus.preferably, the copper content of the alloy is at least 70% by weight.the invention relates to a plating solutions without electricity is capable of autocatalytic type continuous pin hypophosphite alloys described above the solution.in addition, the invention relates to substances which make an autocatalytic activation autocatalytic plating solution non autocatalytic hypophosphite.
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