首页> 外国专利> De-soldering electronic circuit joints - without developing electrostatic potential by absorbing melted solder in earthed conductive braid

De-soldering electronic circuit joints - without developing electrostatic potential by absorbing melted solder in earthed conductive braid

机译:拆焊电子电路接头-通过吸收接地的导电编织物中的熔化焊料而不会产生静电势

摘要

In an method of desoldering a joint between components of an electrical circuit by application of heat, the fused solder is removed by absorption in a wick of electrically conducting braid, one end of which is in contact with the joint while the other is earthed. In a pref. embodiment the circuit includes an earth connector to which the braid is secured by a spring clip. The invention eliminates any damage to sensitive components (e.g. FET's) of the circuit resulting from the development of electrostatic potential theron during the desoldering operation.
机译:在一种通过加热使电路的各部件之间的接头脱焊的方法中,通过吸收在导电编织物的芯子中的吸收来去除熔融的焊料,该导电编织物的一端与接头接触,而另一端接地。在一个偏爱。在本实施例中,电路包括接地连接器,编织物通过弹簧夹固定到接地连接器。本发明消除了在拆焊操作过程中由于静电势theron的发展而对电路的敏感元件(例如FET)的任何损坏。

著录项

  • 公开/公告号FR2407045B1

    专利类型

  • 公开/公告日1983-08-05

    原文格式PDF

  • 申请/专利权人 SPIRIG ERNST;

    申请/专利号FR19770032616

  • 发明设计人

    申请日1977-10-28

  • 分类号B23K3/00;H02K3/34;H02K13/04;

  • 国家 FR

  • 入库时间 2022-08-22 10:02:13

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