Resistive load mfg. method for HF transmission line - using thin metallised semiconductor disc with powdered glass layer to support large number of localised loads with minimal standing waves

摘要

A thin disc (1) of semiconducting material is mechanically and chemically polished on its two large faces. Two resistive contacts (2,3) are formed on these faces by metallisation and heat treatment. A fine grained glass powder, with low dielectric loss, is deposited to form small rectangular pads (4) in rows and columns. A metallic layer (5) with a high resistivity is deposited on the glass powder and a connecting pad (6) is deposited by metallisation of a small area of the metallic layer. A resistive contact (7) is then formed on the large opposing face to these layers to form a contact. The initial metallised contact on the upper surface is completed by a triple metallic layer. The disc is cut along the lines in rows and columns between the pads supporting the resistive leads (8).