首页> 外国专利> Method of producing alloyed metal contact layers on crystal- orientated semiconductor surfaces by energy pulse irradiation

Method of producing alloyed metal contact layers on crystal- orientated semiconductor surfaces by energy pulse irradiation

机译:通过能量脉冲辐照在晶体取向的半导体表面上生产合金化金属接触层的方法

摘要

A region of a semiconductor surface intended for a metal contact is scanned with a closely packed sequence of intense laser light pulses so as to generate a disturbed surface layer and a metal layer is then applied and alloyed into the semiconductor surface. The invention is particularly useful with silicon crystal surfaces orientated in the 100 direction, which for the manufacture of semiconductor components, such as thyristors having controllable short-circuits generated by integrated field effect transistors, are provided on their back side with an aluminum contact or a metal silicide contact.
机译:用紧密排列的强激光脉冲序列扫描用于金属接触的半导体表面区域,以产生受干扰的表面层,然后施加金属层并将其合金化到半导体表面中。本发明对于以<100>方向取向的硅晶体表面特别有用,该硅晶体表面的背面具有铝触点,该硅晶体表面用于制造半导体部件,例如具有由集成场效应晶体管产生的可控短路的晶闸管。或金属硅化物接触。

著录项

  • 公开/公告号US4359486A

    专利类型

  • 公开/公告日1982-11-16

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号US19810289880

  • 发明设计人 EBERHARD F. KRIMMEL;HUBERT PATALONG;

    申请日1981-08-04

  • 分类号H01L21/24;

  • 国家 US

  • 入库时间 2022-08-22 09:52:50

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号