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A method for measurement of temperature distribution over the surface of a sample, and a system for performing such measurement

机译:测量样品表面温度分布的方法和进行这种测量的系统

摘要

The sample (M), for example an integrated semi- conductor circuit element (600), is maintained by a condition setting unit (110) in a first known-temperature (T1) condition and amounts of radiation (P1) from a number of sample surface regions (1 to 18) are detected by a detector (101). The sample (M) is then maintained in a second known-temperature (T2) condition and amounts of radiation (Pz) from the surface regions (1 to 18) are detected by the detector (101).;The sample (M) is then maintained in a specified measuring condition and amounts of radiation (Po) from the surface regions (1 to 18) are detected by the detector (101).;From the amounts of radiation detected (P1, Pz, Po) and the known-temperatures (Ti, T2) an operations unit (200,300,400,500) determinesthe unknown temperature (To) of each of the surface regions (1 to 18) in the specified measuring condition despite the different materials found in the regions.;In relation to an integrated semiconductor circuit element (600) the specified measuring condition may be an operation condition of the element arising when current is applied to the element.
机译:样品(M),例如集成半导体电路元件(600),由条件设定单元(110)保持在第一已知温度(T 1 )条件下,并保持一定量。通过检测器(101)检测来自多个样品表面区域(1至18)的辐射(P 1 )。然后将样品(M)保持在第二已知温度(T 2 )条件下,并保持来自表面区域(1至18)的辐射量(P z )然后由检测器(101)检测。然后将样品(M)保持在指定的测量条件下,并通过以下方法检测来自表面区域(1至18)的辐射量(P o ):检测器(101).;根据检测到的辐射量(P 1 ,P z ,P o )和已知温度( Ti,T 2 )操作单元(200,300,400,500)确定在指定的测量条件下每个表面区域(1至18)的未知温度(To),尽管该区域中发现的材料不同。关于集成半导体电路元件(600),指定的测量条件可以是当电流施加到元件上时出现的元件的操作条件。

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