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FLASH ANNEALING METHOD OF HYDROGENATED AMORPHOUS SILICON

机译:氢化非晶硅的快速退火方法

摘要

PURPOSE:To etch simultaneously the part wherein a polycrystal is not needed without incurring the deterioration of characteristics and the unevenness of the film thickness due to the desorption of hydrogen by carrying out simultaneously the partial polycrystallization of hydrogenated amorphous silicon and the etching. CONSTITUTION:A light transmissible film 3 of a substance such as SiO2, Si3N4, etc. for preventing the desorption of hydrogen is formed on the part of a hydrogenated amorphous silicon thin film 2 formed on a substrate 1. Then the light 4, having higher luminous intensity than that in an ordinary flash annealing method, is irradiated by a xenon flash lamp, etc. to polycrystallize the part of the film 2 covered with the film 3, and the etching of the part of the thin film 2 not covered with the film 3 is simultaneously carried out. In this way, an expensive shading can be dispensed with, and the precision of the position of the polycrystal part can be obtained.
机译:目的:通过同时进行氢化非晶硅的部分多晶化和刻蚀,同时刻蚀不需要多晶的零件,而不会因氢的脱附而导致特性下降和膜厚不均,而无需腐蚀。组成:在衬底1上形成的氢化非晶硅薄膜2的一部分上,形成了一种诸如SiO2,Si3N4等物质的透光膜3,用于防止氢的解吸。通过用氙气闪光灯等照射比通常的闪光退火法更强的发光强度,使被膜3覆盖的膜2的一部分多晶化,对未被膜2覆盖的薄膜2的部分进行蚀刻。膜3同时进行。以此方式,可以省去昂贵的阴影,并且可以获得多晶部分的位置的精度。

著录项

  • 公开/公告号JPS6021807A

    专利类型

  • 公开/公告日1985-02-04

    原文格式PDF

  • 申请/专利权人 RICOH KK;

    申请/专利号JP19830130308

  • 发明设计人 ITAGAKI MASAKUNI;

    申请日1983-07-19

  • 分类号C01B33/02;H01L21/26;H01L21/324;

  • 国家 JP

  • 入库时间 2022-08-22 08:30:09

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