首页> 外国专利> PROCESS FOR THE REMOVAL ELECTROLITICALLY OF NICKEL, CHROME OT GOLD LAYERS FROM THE SURFACE OF COPPER OR CUPRIC ALLOYS AND EQUIPEMNT FOR CARRYING OUT THE PROCESS

PROCESS FOR THE REMOVAL ELECTROLITICALLY OF NICKEL, CHROME OT GOLD LAYERS FROM THE SURFACE OF COPPER OR CUPRIC ALLOYS AND EQUIPEMNT FOR CARRYING OUT THE PROCESS

机译:从铜或铜合金表面上电解去除镍,铬或金金层的工艺以及进行该工艺的设备

摘要

A method for electrolytic removal of a galvanic nickel, chromium or gold layer from a metal base of copper or copper alloy, which is carried out in a bath comprising sulphuric acid and phosphorous acid and/or an organic acid in a concentration, in which the potential of the outer layer is negative and that of the metal base is positive relative to the bath. With such conditions the outer layer will be electrolytically removed and the surface of the metal base gets passive. The removal is finished when the current through the bath decreases below a predetermined threshold value. The apparatus for carrying out the method comprises a current sensor for detecting the current, and if the current decreases below the threshold value, the sensor turns on a current breaker for breaking the current through the bath.
机译:一种从铜或铜合金的金属基体中电解去除电镀镍,铬或金层的方法,该方法在含硫酸和亚磷酸和/或有机酸的浴中进行,其中相对于镀液,外层的电位为负,而金属碱的电位为正。在这样的条件下,外层将被电解去除,并且金属基底的表面变得钝化。当通过熔池的电流减小到预定阈值以下时,去除完成。用于执行该方法的设备包括用于检测电流的电流传感器,并且如果电流减小到阈值以下,则传感器接通用于断开流过浴的电流的电流断路器。

著录项

  • 公开/公告号HU186150B

    专利类型

  • 公开/公告日1985-06-28

    原文格式PDF

  • 申请/专利权人 LATSZERESZETI ESZKOEZOEK GYARAHU;

    申请/专利号HU19820003483

  • 发明设计人 MAGYARFERENCHU;POJBICSJENOEHU;

    申请日1982-10-29

  • 分类号C25F3/02;

  • 国家 HU

  • 入库时间 2022-08-22 08:15:47

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