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LOW TEMPERATURE MELTING BINARY GLASSES FOR LEVELING SURFACES OF INTEGRATED CIRCUITS CONTAINING ISOLATION GROOVES
LOW TEMPERATURE MELTING BINARY GLASSES FOR LEVELING SURFACES OF INTEGRATED CIRCUITS CONTAINING ISOLATION GROOVES
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机译:含绝缘沟的集成电路平整表面的低温熔融二元玻璃
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摘要
-12-LOW TEMPERATURE MELTING BINARY GLASSESFOR LEVELING SURFACES OF INTEGRATED CIRCUITSCONTAINING ISOLATION GROOVESWilliam I. LehrerJohn M. PierceABSTRACTAn integrated circuit structure comprises a pluralityof islands of semiconductor material (16-1 through 16-5)each island being separated from adjacent islands by agroove formed in annular shape around said island tolaterally define the dimensions of each such island, anoxide (12, 14) formed over the surface of saidgrooves (13-1 through 13-6) and a selected glass (15)deposited on said oxide (14) in the grooves and over thetop surface of said device, said glass having the propertythat it melts and flows at a temperature beneath thetemperature at which dopants in the islands of semicon-ductor material substantially redistribute, said selectedglass (15) having a substantially flat top surface therebyto give said structure a substantially flat top surface.
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