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ALLOY VAPOR-DEPOSITING METHOD AND ALLOY VAPOR-DEPOSITING DEVICE
ALLOY VAPOR-DEPOSITING METHOD AND ALLOY VAPOR-DEPOSITING DEVICE
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机译:合金蒸气沉积方法及合金蒸气沉积装置
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摘要
PURPOSE:To reduce a variance of a density distribution of a component element of a vapor-deposited film, and to stabilize said distribution by executing an alloy vapor deposition by a device having a structure for executing successively heating and vapor deposition by dividing into small portions a vapor-depositing material consisting of different elements of two kinds or more. CONSTITUTION:Alloy material consisting of selenium-tellurium having a prescribed component ratio is divided equally and contained in a vessel 15, and thereafter, an open air shielding body 3 is set onto a pedestal 2 by installing an aluminum drum 24, and the inside of a vacuum vapor depositing chamber 5 is maintained in a vacuum by executing an exhaust. Subsequently, a vapor depositing heater 10 is electrically conducted and a vessel moving motor 21 is driven, and first of all, a vapor depositing material in the first vessel 15 is heated and evaporated, and a vapor-deposited film is formed on the drum 24 which is being rotated by being pre-heated up to a prescribed temperature by the heater 10. Within a prescribed time when this first evaporation is not completed, the second vessel 15 is also moved into the heating area. By executing successively such an operation, the vapor-deposited film is formed on the drum 24. In this way, a dispersion of a density distribution of a component element of the vapor-deposited film can be reduced.
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