首页> 外国专利> thermoplastic rigid and semi-rigid structures with more samstrengsprutande polymer layer, which includes an inner layer of vinylidenkloridsampolymer,and anvendning of these structures for framstellning of forpackningar

thermoplastic rigid and semi-rigid structures with more samstrengsprutande polymer layer, which includes an inner layer of vinylidenkloridsampolymer,and anvendning of these structures for framstellning of forpackningar

机译:具有更多三聚醚聚合物层的热塑性刚性和半刚性结构,该结构包括乙烯基侧链三聚体的内层,并且对这些结构进行修补以用于包装

摘要

The thermoplastic structures incorporate an inner vinylidene chloride copolymer layer, each face of which is bonded to a vinyl chloride polymer (2) layer through the intermediacy of a separate intermediary vinyl chloride polymer (1) layer whose gel temperatrue and dynamic viscosity are lower than those of the adjacent vinyl chloride polymer (2). The thermoplastic structures with multiple coextruded polymeric layers may be in the form of sheets, plaques, tubes or rigid or semirigid hollow bodies, which can be employed in the field of packaging.
机译:热塑性结构包含一个内部的偏二氯乙烯共聚物层,该层的每一面通过单独的中间氯乙烯聚合物(1)层的中间层与氯乙烯聚合物(2)层相连,该中间层的凝胶温度和动态粘度低于相邻的氯乙烯聚合物(2)的基团。具有多个共挤出的聚合物层的热塑性结构可以是片,片,管或刚性或半刚性的中空体的形式,其可以在包装领域中使用。

著录项

  • 公开/公告号SE8503514L

    专利类型

  • 公开/公告日1986-01-20

    原文格式PDF

  • 申请/专利权人 SOLVAY;

    申请/专利号SE19850003514

  • 发明设计人 VANDENDAEL Y;DEHENNAU C;

    申请日1985-07-18

  • 分类号B32B27/30;B65D65/40;

  • 国家 SE

  • 入库时间 2022-08-22 07:39:44

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