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Method for coating optical substrates with antireflective coatings that can be etched
Method for coating optical substrates with antireflective coatings that can be etched
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机译:用可蚀刻的抗反射涂层涂覆光学基板的方法
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摘要
The method belongs to the metal evaporation by deposits category in a reactive atmosphere in the chamber of a vacuum evaporator. It consists in placing in the chamber pre-cleaned substrates, evacuating the chamber by a conventional jusqur process to obtain a pressure of at most 1.5 μ Pa (10 -8 torr), injecting pure oxygen at a flow rate adjusted so that the pressure is between 2 and 4 m Pa to 3 Pa m (2 x 10 -5 torr). to expose a heated boat arranged in the chamber and containing chromium at a temperature such as a chromium oxide layer grows in thickness on the substrates from 0.1 to 0.5 nm per second, to 0.2 nm per second, and to hide the platform when the chromium oxide layer has reached a thickness corresponding to the first extinction in specular reflection at substantially normal incidence. The growth rate is controlled by the resonance derived from a quartz which is subjected to the repository. Extinction is controlled in white light at 3400 K on a substrate witness previously metallized.
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机译:该方法属于在真空蒸发器的腔室中的反应性气氛中按沉积物类别进行金属蒸发的方法。它包括将预先清洁的基板放入腔室中,通过常规的jusqur工艺将腔室抽空以获得最高1.5μPa(10 -8 Sup> torr)的压力,并以流动的方式注入纯氧调整压力,使压力在2-4 m Pa至3 Pa m(2 x 10 -5 Sup>托)之间。暴露设置在腔室中并在一定温度下包含铬的加热舟皿,例如氧化铬层在基板上的厚度从每秒0.1到0.5 nm增长到每秒0.2 nm,并在氧化铬隐藏时隐藏平台在基本垂直入射时,镜面反射层的厚度已达到镜面反射中第一次消光的厚度。生长速率由受到储存库石英的共振控制。在预先镀有金属的基材上,在3400 K的白光下控制消光。
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