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Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier
Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier
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机译:大规模集成电子组件的连接触点与组件载体上电连接装置的触点之间的电连接的三维扩展的方法
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摘要
According to this method for three-dimensional expansion of the electrically conductive connections between the connecting contacts (2) of large-scale integrated electronic components, especially of semiconductor circuits which are arranged especially in flat-pack housings (1), and the contact points of an electrical connecting device on a component carrier (5), the connecting contacts (2) are arranged in a three-dimensional manner on the housing (1) or are aligned with respect to a connecting device on a component carrier (5) in such a manner that the connecting points of the individual connecting contacts (2) to the contacts of the connecting device are arranged in a distributed manner on the component and/or on the component carrier (5) on at least two contact point planes which run one above the other. IMAGE
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