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Process and electrolyte for electroplating tin, lead or tin-lead alloys

机译:电镀锡,铅或锡铅合金的工艺和电解质

摘要

A process and bath for electroplating tin, lead and tin-lead alloys. Improved brightness, solderability and broader current density ranges are achieved by the use in the baths of a soluble alkylene oxide condensate to provide a cloud point of the bath above about 90° F., a soluble bismuth compound, an aromatic aldehyde and acetaldehyde. Tin and lead are supplied to the bath as salts of alkyl or alkylol sulfonic acids with sufficient free alkyl or alkylol sulfonic acid to provide a bath pH of less than 3.
机译:一种电镀锡,铅和锡铅合金的工艺和镀液。通过在浴中使用可溶性环氧烷烃冷凝物以提供约90°F以上的浴浊点,可溶性铋化合物,芳族醛和乙醛,可实现更高的亮度,可焊性和更宽的电流密度范围。锡和铅以烷基或羟烷基磺酸与足够的游离烷基或羟烷基磺酸的盐形式提供给熔池,以使熔池的pH值小于3。

著录项

  • 公开/公告号US4617097A

    专利类型

  • 公开/公告日1986-10-14

    原文格式PDF

  • 申请/专利权人 LEARONAL INC.;

    申请/专利号US19850778353

  • 申请日1985-09-20

  • 分类号C25D3/32;C25D3/36;C25D3/56;C25D3/60;

  • 国家 US

  • 入库时间 2022-08-22 07:28:42

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