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Compact combiner for use with semiconductor devices in the microwave frequency range

机译:紧凑型组合器,可与微波频率范围内的半导体器件配合使用

摘要

A metallic support supports a number of semi-conductor devices surrounded by an annular dielectric substrate which in turn supports a circuit including at least two microstrip lines and a metallic circular output element. The small thickness and high dielectric constant of the substrate are selected to permit a reduction in width and in length of the microstrip lines which are folded-back in a curvelinear fashion and placed on the substrate along circular arcs which are concentric with the output element.
机译:金属支撑件支撑由环形电介质衬底围绕的多个半导体器件,该半导体器件又支撑包括至少两条微带线和金属圆形输出元件的电路。选择衬底的小厚度和高介电常数以允许减小微带线的宽度和长度,该微带线以曲线线性的方式折回并沿着与输出元件同心的圆弧放置在衬底上。

著录项

  • 公开/公告号US4617528A

    专利类型

  • 公开/公告日1986-10-14

    原文格式PDF

  • 申请/专利权人 THOMSON CSF;

    申请/专利号US19830536393

  • 发明设计人 NARGUISE MAMODALY;ALAIN BERT;

    申请日1983-09-27

  • 分类号H01B1/00;H01P5/12;

  • 国家 US

  • 入库时间 2022-08-22 07:28:43

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