METHOD FOR CONTINUOUS METAL DEPOSITION FROM A NON-AUTOCATALYTIC ELECTROLESS PLATING BATH USING ELECTRIC POTENTIAL

摘要

A method of continuously depositing a metallic plating on the surface of a workpiece from a non-autocatalytic electroless plating bath that is normally inherently self-limiting as to the thickness of metal which can be deposited by electrolessly plating by applying an electric potential on the workpiece in the electroless bath. The method provides non-autocatalytic baths, such as hypophosphite-reduced electroless copper baths, with the ability to plate on nonconductors to a desired thickness which increases with time at a rate dependent on the amount of current applied A more uniform thickness of deposit over the workpiece being plated and greater deposit penetration into blind holes, deep recesses and tubular portions of complex-shaped parts is obtainable by the method.