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The polymer composition sensitive to the application or to the radiation, its use in order to form the drawings, in relief, and compounds used in this composition

机译:对应用或辐射敏感的聚合物组合物,其在形成图中的用途(凸版)以及用于该组合物中的化合物

摘要

Polymer composition sensitive to the application or to the radiation, its use in order to form the drawings, in relief, and compounds used in this composition. / p & & p & the polymer composition sensitive to the application or to the radiation, comprises a poly (amic acid) having, as main component, a unit repetitive of formula: & br / (see appended drawing in bopi) & br / b one or more compounds which are sensitive to the application or to the radiation, comprising an amino group and an aromatic group, azide or an aromatic group sulfonylazide in its molecule, and if necessary, one or several photosensitizers and or amine compounds containing at least one unsaturated, and or of one or more compounds comprising at least two links unsaturated ketones in their molecule, the said composition being extremely sensitive to the application and the radiation and which can give a relief pattern national on a substrate. In addition, the polyimide film finally obtained has an excellent resistance to heat. / p & & p & use of this composition for the manufacture of the drawings, in relief on a support.
机译:对应用或辐射敏感的聚合物组合物,用于形成附图的凸版使用的聚合物以及用于该组合物的化合物。 & &对应用或辐射敏感的聚合物组合物包含具有以下结构单元重复的聚(酰胺酸)作为主要成分: br />(请参阅bopi中的附图)& b一种或多种对应用或辐射敏感的化合物,在其分子中包含氨基和芳族基团,叠氮化物或芳族磺酰叠氮化物,必要时还可以包含一种或几种光敏剂和/或胺化合物在其分子中含有至少一种不饱和和/或一种或多种包含至少两个连接不饱和酮的化合物,所述组合物对应用和辐射极为敏感,并且可以在基材上形成凹凸图案。另外,最终获得的聚酰亚胺膜具有优异的耐热性。 & &将该组合物用于制造附图,以减轻支撑物的负担。

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