首页> 外国专利> Compositions for dielectric sealing applications comprising terpolymer emulsions of ethylene, vinyl esters and n-methylol comonomers blended with PVC emulsions buffered at a pH greater than 7

Compositions for dielectric sealing applications comprising terpolymer emulsions of ethylene, vinyl esters and n-methylol comonomers blended with PVC emulsions buffered at a pH greater than 7

机译:用于介电密封的组合物,包括乙烯,乙烯基酯和正羟甲基共聚单体的三元共聚物乳液,与在pH值大于7的PVC乳液混合

摘要

A binder suitable for dielectric sealing may be prepared comprising a blend of a polyvinyl halide emulsion and an aqueous emulsion comprising a vinyl ester of an alkanoic acid interpolymerized with PP(a) 5 to 28% by weight of ethylene;PP(b) 0. 5 to 4% by a weight of an N-methylol containing copolymerizable monomer; P P(c) 0 to 3% by weight of a latex stabilizer; and PP(d) 0 to 1% by weight of at least one polyunsaturated copolymerizable monomer,PPthe binder having a Tg of - 15° to +35. degree. C. and being buffered to a pH greater than 7.
机译:可以制备适合于介电密封的粘合剂,该粘合剂包括聚卤乙烯酯乳液和包含链烷酸的乙烯基酯与5至28重量%的乙烯共聚的链烷酸的乙烯基酯的共混物的共混物。 P> P(b):0〜5〜4重量%的含N-羟甲基的可共聚单体。 (c)0至3重量%的乳胶稳定剂;和

(d)0至1重量%的至少一种多不饱和可共聚单体,

粘合剂的Tg为-15°至+35。度。 C.并缓冲至pH大于7。

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