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Compositions for dielectric sealing applications comprising terpolymer emulsions of ethylene, vinyl esters and n-methylol comonomers blended with PVC emulsions buffered at a pH greater than 7
Compositions for dielectric sealing applications comprising terpolymer emulsions of ethylene, vinyl esters and n-methylol comonomers blended with PVC emulsions buffered at a pH greater than 7
A binder suitable for dielectric sealing may be prepared comprising a blend of a polyvinyl halide emulsion and an aqueous emulsion comprising a vinyl ester of an alkanoic acid interpolymerized with PP(a) 5 to 28% by weight of ethylene;PP(b) 0. 5 to 4% by a weight of an N-methylol containing copolymerizable monomer; P P(c) 0 to 3% by weight of a latex stabilizer; and PP(d) 0 to 1% by weight of at least one polyunsaturated copolymerizable monomer,PPthe binder having a Tg of - 15° to +35. degree. C. and being buffered to a pH greater than 7.
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