首页> 外国专利> METHOD OF METALLURGICALLY COUPLING COMPOSITE AND LAMINATED METALLIC PLATE AND COMPOSITE AND LAMINATED METALLIC PLATE

METHOD OF METALLURGICALLY COUPLING COMPOSITE AND LAMINATED METALLIC PLATE AND COMPOSITE AND LAMINATED METALLIC PLATE

机译:复合材料和层合金属板的冶金耦合方法及复合材料和层合金属板

摘要

An improved method is described for metallurgically bonding a composite metal plate (from which structural transition joints may be cut) wherein an outer layer and a metal interlayer of a different composition are propelled towards a metal base layer by means of the detonation of a layer of explosive disposed adjacent to the outer surface of the outer layer. The interlayer is only 0.25 to 4 mm thick and it is initially disposed at a stand-off distance from the base layer not exceeding 6 mm or 8 times the interlayer thickness. The outer layer has a mass of at least twice the mass of the interlayer and it is initially separated from the interlayer by a stand-off distance which is 0.5 to 10 times the thickness of the outer layer and is at least 3 times the distance between the base layer and the interlayer.
机译:描述了一种用于冶金结合复合金属板(可以从其上切割出结构过渡缝)的改进方法,其中借助于引爆一层铝而引爆具有不同组成的外层和金属夹层朝向金属基层。炸药布置在外层的外表面附近。中间层仅0.25至4mm厚,并且其最初以距基层的间隔距离不超过6mm或中间层厚度的8倍的方式设置。外层的质量至少是中间层质量的两倍,并且它最初与中间层分开的支撑距离是外层厚度的0.5到10倍,并且是至少两层之间的距离的3倍基础层和中间层。

著录项

  • 公开/公告号JPS63112085A

    专利类型

  • 公开/公告日1988-05-17

    原文格式PDF

  • 申请/专利权人 IMPERIAL CHEM IND PLC ICI;

    申请/专利号JP19860253898

  • 发明设计人 ROI HAADOUITSUKU;

    申请日1986-10-27

  • 分类号B23K20/08;B23K35/00;

  • 国家 JP

  • 入库时间 2022-08-22 07:08:19

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